Corning EDGE™ Data Center Solutions | Corning

EDGE™/EDGE8® TAP modules enable passive optical tapping of the network while reducing downtime and link loss, and increase rack space utilization and density compared to other optical tap options.
Monitored ports can be added without disrupting the system’s live traffic, and insertion loss in the link is reduced by the integration of the passive optical tapping into the module.

The EXACT solution is an expansion of our multi award-winning EDGE™ Solutions Portfolio, providing a reduced excess length cabling infrastructure where optical path system measurement is critical for the end-user service offering.

Introducing the MDC (mini duplex connector), one of the very small form factor connectors (VSFFCs), enables connecting directly from one high-speed transceiver to another or maximizing port density per rack unit in the structured cabling and helps to lower the total cost of ownership.

As the size of our networks grew during the last decade, we saw a shift from classical 3-tier network architectures to a flatter and wider Spine-and-Leaf architecture. With its fully meshed connectivity approach, Spine-and-Leaf architecture provided us with the predictable high-speed network performance we were craving and reliability in our network switch fabric.